Specifications
| Essentials |
| Status |
Launched |
| Launch Date |
Q1'10 |
| Processor Number |
i3-530 |
| # of Cores |
2 |
| # of Threads |
4 |
| Processor Base Frequency |
2.93 GHz |
| Intel® Smart Cache |
4 MB |
| Bus/Core Ratio |
22 |
| DMI |
2.5 GT/s |
| Instruction Set |
64-bit |
| Instruction Set Extensions |
SSE4.2 |
| Embedded |
No |
| Supplemental SKU |
No |
| Processing Die Lithography |
32 nm |
| Max TDP |
73 W |
| 1ku Bulk Budgetary Price |
$113.00 |
| Memory Specifications |
| Max Memory Size(dependent on memory type) |
16 GB |
| Memory Types |
DDR3-1066/1333 |
| # of Memory Channels |
2 |
| Max Memory Bandwidth |
21 GB/s |
| Physical Address Extensions |
36-bit |
| ECC Memory Supported |
Yes |
| Graphics Specifications |
| Integrated Graphics |
Yes |
| Intel® HD Graphics |
Yes |
| Graphics Base Frequency |
733 MHz |
| Intel® Flexible Display Interface (Intel® FDI) |
Yes |
| Intel® Clear Video HD Technology |
Yes |
| Dual Display Capable |
Yes |
| Expansion Options |
| PCI Express Revision |
2.0 |
| PCI Express Configurations |
1x16, 2x8 |
| # of PCI Express Ports |
1 |
| Package Specifications |
| Max CPU Configuration |
1 |
| Package Size |
37.5mm x 37.5mm |
| Processing Die Lithography |
32 nm |
| Processing Die Size |
81 mm2 |
| # of Processing Die Transistors |
382 million |
| Graphics and IMC Lithography |
45 nm |
| Graphics and IMC Die Size |
114 mm2 |
| # of Graphics and IMC Die Transistors |
177 million |
| Sockets Supported |
FCLGA1156 |
| Halogen Free Options Available |
Yes |
| Advanced Technologies |
| Intel® Turbo Boost Technology |
No |
| Intel® Hyper-Threading Technology |
Yes |
| Intel® Virtualization Technology (VT-x) |
Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) |
No |
| Intel® Trusted Execution Technology |
No |
| AES New Instructions |
No |
| Intel® 64 |
Yes |
| Idle States |
Yes |
| Enhanced Intel® Speedstep Technology |
Yes |
| Intel® Demand Based Switching |
No |
| Thermal Monitoring Technologies |
No |
| Execute Disable Bit |
Yes |
